In the inspection of SMT, visual inspection and optical equipment inspection are often used. There are only visual inspection and two mixed methods. All of them can check 100% of the products, but if the visual inspection method is used, people will always be tired, so it can’t guarantee that employees can check 100% seriously. Therefore, we need to establish a balanced inspection and monitoring strategy, that is to establish quality process control points.
In order to ensure the normal operation of SMT equipment, strengthen the quality inspection of the workpiece in each process, so as to monitor its operation status, quality control points are set up after some key processes.
These control points are usually set up in the following locations:
1： PCB test
1. Whether the PCB is deformed;
2. Whether the pad is oxidized;
3. Whether the surface of the PCB is scratched;
Inspection method: visual inspection according to the inspection standard.
2： Screen printing detection
1. Whether the printing is complete;
2. Whether there is bridging;
3. Whether the thickness is uniform;
4. Whether there is collapse;
5. Whether there is deviation in the printing; 4;
Inspection method: visual inspection or magnifying glass inspection according to the inspection standard.
3： Patch detection
1. The mounting position of the component;
2. Whether there is chip dropping;
3. Whether there is wrong part;
4. Whether the polarity component is reversed
Inspection method: visual inspection or magnifying glass inspection according to the inspection standard.
4： Reflow soldering inspection
1. The welding condition of components, whether there are bad welding phenomena such as bridging, erecting stele, dislocation, solder ball, false welding, etc.
2. The condition of solder joints
Inspection method: visual inspection or magnifying glass inspection according to the inspection standard
